HomeComplex level 3

Complex level 3

Publish Time: 2025-10-11

    1. Material: Tinplate
    2. Surface treatment: None
    3. Process: Progressive Stamping 
    4. Feature description:  
    (1) RF shield, can obstruct the signal;
    (2) 0.2mm thin material, big holes in the middle, narrow edge, after stamped, still make good flatness.

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